Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences
Tuesday, September 8, 2015
SCV EMC Society
Subject: Very-Near-Field Solutions to EMC Compliance Problems – Real World Case Study
– insightful diagnostics, improve pre-compliance preparation, solve problems at a board level …
Speaker: Ruska Patton, EMSCAN Corporation
Time: 5:30 pm: Networking/Light Dinner; 6:30 pm: Presentation
Cost: free, including water and soft drinks. Light dinner is available for a small fee.
Location: CETECOM Inc., 411 Dixon Landing Rd. Milpitas
Event Details: http://ewh.ieee.org/r6/scv/emc/
RSVP: Not necessary
Wednesday, November 18, 2015
SF Power and Energy (PES)
Subject: How Do Power Cable Systems Fail? Debunking the Myths and Implementing the New Paradigm
– Insight into empirical evidence and lessons learned, debunk some common theories and myths, new life-cycle paradigm…
Speaker: Ben Lanz, Applications Engineering Manager – IMCORP
Time: 11:30 am – 1:00 pm
Cost: $5 – IEEE members, IEEE Life Members and Students; $10 – Non IEEE members
Location: CPUC, Golden Gate Room, 505 Van Ness Avenue, San Francisco
Event Details: https://meetings.vtools.ieee.org/m/33677
Tuesday, September 1, 2015
SCV Photonics Society
Subject: Mobile Holography – Manipulating Holograms in the Palm of Your Hands
– Introducing the technology behind LEIA’s holographic Development Kit scheduled for release in Q4 2015…
Speaker: Dr. David Fattal, CEO of LEIA Inc.
Time: 6 to 7 pm, check-in, light dinner, networking; 7 to 8:30 pm: presentation
Cost: Free
Location: Dolby 432 Lakeside Dr., Sunnyvale
Event Details: http://ewh.ieee.org/r6/scv/
IEEE GHTC (global humanitarian technology conference) focuses on advancing technology for the benefit of humanity. This cross-disciplinary annual conference provides the perfect venue for those interested in humanitarian projects to join their peers in Seattle in October 2015.
GHTC is focused on bringing together people to address the critical issues for the benefit of the resource-constrained and vulnerable populations in the world. It is an opportunity for IEEE to work with NGOs to identify the most pressing needs.
Interactive special sessions that support in-field humanitarian efforts:
Open Data Kit Workshop – learn to collect data and build data services for many humanitarian efforts
Entrepreneurship and Education – engage in workshops with interactive dialogue on grass-roots business development and collaborative educational strategies for entrepreneurs and practitioners
Demonstrations and Exhibitions – see and experience new technologies in water and sanitation, energy, and communication and connectivity technologies
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Thursday, September 3, 2015
SCV Technology and Engineering Management Society (TEMS)and SCV Women in Engineering (WIE)
Subject: Women in Engineering in Management: Truth Talk
Panelists are IEEE WIE leaders: Susan Delafuente, Roxsana Hadjizadeh, Kimara Chin, and Suzette Pangrle
Panel Moderator: Susan Delafuente, WIE Chapter Chair
Time: 6:00 pm
Cost: $10 including dinner
Location: AMD, 1 AMD Place, Commons Building, Sunnyvale
Event Details: http://www.ieee-scv-tmc.org
Tuesday, September 15, 2015
SF Nanotechnology Council
Subject: Emerging Non-volatile Memory, enabled by Carbon Nano-materials
- Frontier research, emerging nanoscale memory devices and architectures, RRAM, PCM, and STT-MRAM technologies…
Speaker: Dr. Ethan C. Ahn, Dept of Electrical Engineering, Stanford Nanoelectronics Lab
Time: 11:30 – Networking, Pizza & drinks; 12:00 noon to 1 pm – Seminar
Cost: Free
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details and Registration: http://sites.ieee.org/sfbanano/
The market for commercial drones is red hot, and the co-location of InterDrone – The International Drone Conference and Exposition – contributes a two-day technical conference for engineers and software developers building drones, along with an overlapping conference for commercial drone buyers and flyers. As the first global-scale commercial drone conference, InterDrone is an ideal partner for CTIA Super Mobility 2015. Express shuttles will run between the two Las Vegas event sites September 9-11.
More than 80 exhibits
Industry reception and networking
The Yes-Fly Zone Drone demo area
Two Technical Conferences include:
Drone TechCon for Builders – more than 30 classes, tuitorials, and panels for hardware adn embedded engineers, designers, and software developers building commercial drones and the software which controls them.
Drone Flyer: for Flyers and Buyers – more than 30 tutorials and classes on drone operations, flying tips and tricks, range navigation, payloads, stability, avoiding crashes, power, environmental considerations, which drone is for you, and more.
Bonus extras!
Drone Business, special agriculture track, Women in Drones luncheon and panel, The Hanger – featuring new startup drone companies, and a film festival.www.InterDrone.com
23rd International Symposium on High Performance InterconnectsThe IEEE HOT INTERCONNECTS 23 Conference on August 26-28 features state- of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip networks to those within systems, clusters, data centers, and clouds. See the completeAdvance Program for conference, tutorials and keynotes. The conference and tutorials are discounted for Registration before August 14.
* Host Keynote: Commercial Computing Trends and Their Impact on Interconnect Technology – Rick Hetherington, Oracle
* Keynote 2: Recent Advances in Machine Learning and Their Application to Networking – David Meyer, Brocade
* Invited Paper: Intel Omni-Path Architecture: Enabling Scalable-, High-Performance Fabrics – Todd Rimmer, Intel; * Panel: HPC vs. Data Center Networks; Regular Sessions: * Network and Interface Architectures, * Optics and NOCs, * Efficient Network Design; Tutorials: * Accelerating Big Data Processing with Hadoop, Spark, and Memcached Over High-Performance Interconnects, * ONOS Tutorial Hot Interconnect, * Flow and Congestion Control for High Performance Clouds: How to Design and Tune the Datacenter Fabric & SDN for Big Data, * Software-defined Wide-Area Networking: Challenges, Opportunities and Reality
Wednesday, September 30, 2015
SCV Consultants’ Network of the Silicon Valley (CNSV)
Subject: How Non-Volatile Memory Became the World’s Most Valuable Semiconductor Storage
– Floating gate, three important people in the history of NVM: Eli Harari, Stefan Lai and Jeff Katz, who played pivotal roles …
Speakers: Eli Harari, Stefan Lai, and Jeff Katz
Moderator: Brian Berg
Time: 6:30 to 8:30 pm
Cost: Presentation is free
Location: KeyPoint Credit Union, 2805 Bowers Ave., Santa Clara
Event Details: https://californiaconsultants.org/event/non-volatile-memory-most-valuable-storage/
The Electrical Engineering Department at Sonoma State University invites qualified candidates to apply for the part-time instructor position to teach the related topics, including: Programing and Modeling, VHDL, Digital Signal Processing, RF & Wireless, Fiber Optics Communications.
In addition, the following teaching positions are immediately available for Fall 2015:
ES 220: Electronics II (4) / Lecture: T & TH: 1-2:15 pm Lecture / Lab W: 1-3:45 pm
ES 400: Linear System Theory (3) / Lecture: Mon & Wed 4:00-5:15 pm
ES 210: Digital Circuit & Logic Design (4) – Lecture: Mon & Wed 1:00-2:15 / Lab: 2:15-5:00 pm
ES 112: Fundamentals of Digital Logic Design (1) – Lab Only: Tuesday 9:00-11:45 am
The expected starting date for the above courses is August 24, 2015. More information about the courses can be found here:http://www.sonoma.edu/engineering/courses.html. The Fall class schedule is available here:http://www.sonoma.edu/engineering/schedules/schedule_fa2015.pdf.
Required qualifications: Ph.D. in relevant areas of specialties or Master’s degree with extensive industry experience. The part-time instructor position is a paid position. For more information please contact: [email protected].
Sonoma State University is 50 minutes north of the Golden Gate Bridge and is one of 23 campuses in the California State University system.
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23rd International Symposium on High Performance Interconnects
The IEEE HOT INTERCONNECTS 23 Conference on August 26-28 features state- of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip networks to those within systems, clusters, data centers, and clouds. See the complete Advance Program for conference, tutorials and keynotes. The conference and tutorials are discounted for Registration before August 14.
* Host Keynote: Commercial Computing Trends and Their Impact on Interconnect Technology – Rick Hetherington, Oracle
* Keynote 2: Recent Advances in Machine Learning and Their Application to Networking – David Meyer, Brocade
* Invited Paper: Intel Omni-Path Architecture: Enabling Scalable-, High-Performance Fabrics – Todd Rimmer, Intel; * Panel: HPC vs. Data Center Networks; Regular Sessions: * Network and Interface Architectures, * Optics and NOCs, * Efficient Network Design; Tutorials: * Accelerating Big Data Processing with Hadoop, Spark, and Memcached Over High-Performance Interconnects, * ONOS Tutorial Hot Interconnect, * Flow and Congestion Control for High Performance Clouds: How to Design and Tune the Datacenter Fabric & SDN for Big Data, * Software-defined Wide-Area Networking: Challenges, Opportunities and Reality
Tuesday, August 25, 2015
SCV Consumer Electronics (CE)
Subject: 3D Printed Package Components for High Performance Packaging
– print complex structures with multi-material inks, mechanics of the technology and manufacturing platform, package types such as SiP, PoP …
Speaker: Philip Rogren, VP of Product Development, EoPlex
Time: 6:30 pm: pizza & drinks, 7:00 – 8:30 pm: Presentation
Cost: IEEE members – $5, Non-IEEE members – $10, IEEE CES and IEEE Student members – Free
Location: NVIDIA – 2800 Scott Blvd., Building E, Santa Clara
Event Details: https://www.eventbrite.com/e/ieee-consumer-electronics-society-aug-25-2015-3d-printed-package-components-for-high-performance-tickets-17963994792
Thursday, October 15, 2015
SCV Signal Processing Society (SPS)
Subject: Gathering Light
– prime lenses that provide an optical zoom, small mirrors allow reconfiguring the cameras to select.., architecture of this flexible computational camera…
Speaker: Dr. Kari Pulli, VP of Computational Imaging, Light
Time: 6:30 pm: Networking/Light Dinner; 7:00 pm: Announcements; 7:05 to 8:15 pm: Presentation
Cost: Free
Location: AMD Commons C-6/7/8, 991 Stewart Dr., Sunnyvale
Event Details: http://www.ewh.ieee.org/r6/scv/sps/20151015Abstract.html
Thursday, August 13, 2015
SCV Technology and Engineering Management Society (TEMS)
Subject: Understanding an Industry Technical Staff Pipeline
– how the corporate staffing system works, criteria are used for career advancement…
Speaker: Dr. Michael Condry, Former Chief Technical Officer, Intel Corp.
Time: 8:00 – 9:00 AM (PDT)
Cost: Free
Location: Webinar
Event Details: https://lnkd.in/ejsU7je
Thursday, August 27, 2015
SCV Components, Packaging, and Manufacturing Technologies (CPMT)
Subject: Packaging Solutions and Innovations with Compression Molding
– large-area-size substrates, limited by current transfer mold, slow “dipping” of the devices into either a melted granular or liquid mold compound …
Speaker: C. H. Ang, Senior Technical Support Manager, TOWA, USA
Time: 11:30 am, check-in, light food, networking; 12 noon: presentation
Cost: $5 non-IEEE members, Free for members (please use code IEEE2015); Talk-Only: Free
Talk-Only attendees: please check-in by 11:45
Location: Texas Instruments, Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: http://www.cpmt.org/scv/meetings/cpmt1508l2.html
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