IEEE S.F. Bay Area Council e-GRID's
BayAreaTech

WEDNESDAY May 9, 2012
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Dr. Bill Bottoms, Chair, Technical Working Group for Packaging and Package Substrates, iNEMI (International Electronics Manufacturing Initiative)
Time: Buffet dinner at 6:00 PM, Presentation at 6:45 PM
Cost: $20 if reserved by May 7; $10 for fulltime students and currently unemployed engineers; $5 more at the door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1205.html

The primary objective of technology roadmaps has been to define in advance the difficult challenges or roadblocks that could limit or stop progress in the future. Topics that are changing rapidly and pose difficult challenges identified in the 2012 Roadmaps include:
- 2.5 D Interposer technology
- 3D-TSV integration
- New materials to meet thermal/mechanical/electrical and chemical property requirements
- Packaging requirements for photonic devices: emitters and absorbers of photons; photonic data communication components
- New power devices (based on compound/ direct band gap semiconductors)
The difficult challenges and potential solutions in today’s version of these Roadmaps will be discussed for these emerging packaging technologies.