Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences
WEDNESDAY September 12, 2012
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Arthur L. Chait, CEO, EoPlex
Time: Optional dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $20 for dinner ($10 for students, unemployed)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv
Producing a part in real-time with a rapid prototyping machine is magical to watch. The popular media loves to speculate about future scenarios where a consumer will be able to purchase and download a device and have it produced, Star Trek-fashion, in this way. Unfortunately dissimilar materials like silicon, wiring, glass, metal and plastic required very different processing parameters and present challenges for rapid prototyping that may never be overcome. In the meantime, there is a class of additive manufacturing that is not as flashy, but is being used for actual high-volume manufacturing. In this presentation, Arthur L. Chait, CEO of EoPlex Inc. will illustrate some examples of semiconductor parts, micro antennas, and other products that are being produced by additive processing.
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