July 13: IEEE e-GRID - San Francisco Bay Area Council

More information about the
IEEE International Electronics Manufacturing Technology Symposium

Information and Registration for the IEMT
... with a focus on device packaging, assembly, lead-free soldering, Green electronics, and more.

Professional Development Classes (on Tuesday, July 13):
Morning Classes Afternoon Classes
"Introduction to Flip Chip Technology — A User's Guide", 8:30-noon - a detailed look at applications, design, reliability, infrastructure, materials and processing

"Materials, Processes and Defect Recognition for Hybrids, Microcircuits and RF/MMIC Modules", 8:30-noon - understanding defects in relationship to the process, and in conjunction with customer expectations and end-use environment

"Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics, 8:30-noon - solutions for next-generation microelectronics and where packaging and interconnection are are going

"Flip Chip Failure Mode Analysis for Package and Board Assemblies", 1:30-5PM - reliability test procedures and common failure modes in advanced area-array packages and board assemblies

"Lead-Free Soldering — Metallurgical Fundamentals, Reflow Applications, and Challenges", 1:30-5PM - the fundamental design considerations of lead-free alloys, with emphasis on metallurgical properties analysis - includes textbook

"Nano - The Next Technology", 1:30-5PM - an overview of potential applications and some of the complexities of developing nano-technology products

For more information, contact Gloria Lou at SEMI.

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